Bill D. Cook Assistant Professor
University of Houston
Manufacturing, Materials, and Device Innovations for Soft and Curvy Electronics
Monday, February 13, 2017
to 4:30 PM
128 Mechanical Engineering Building
6100 Main St
Houston, Texas, USA
Innovative manufacturing technologies and materials are critical in building nextgeneration electronics devices, especially when we are migrating from conventional electronics to emerging electronics with unique form factors, such as those flexible, stretchable and wearable electronics, which hold promise in a broad range of areas such as healthcare, biomedical, robotics, human-machine interfaces, etc.
In this talk, I will give an overview of our research program at University of Houston on manufacturing, materials, and device innovation for flexible, stretchable and curvy electronics. I will first present our recent advancements in high performance soft electronics based on heterogeneously integrated single crystal semiconductor. An ultra-thin Si flex-camera will be demonstrated. Existing strategies to enable mechanical stretchability in soft electronics heavily
rely on mechanical architectures and device configurations, which impose a heavy burden on sophisticated fabrication and associated cost. I will show our recent results on developing acompletely new set of stretchable electronics, namely “intrinsically stretchable rubbery electronics, circuits and sensors”. Such devices are based on all-elastomeric electronic materials and therefore intrinsically stretchable without the need of any special structural design. Such intrinsically stretchable rubbery electronics mimics the format and functionalities of our elastic
human skin. The last part of my talk will show our recent progress on developing 3D curvilinear shaped devices. A new manufacturing approach, namely conformal additive transfer printing, will be discussed. Different type of 3D curvilinear device such as smart contact lenses with integrated sensors and electronics for multi-functionalities will be demonstrated.
Biography of Cunjiang Yu:
Cunjiang Yu received his Ph.D. in Mechanical Engineering at Arizona State University in
2010, and was a postdoc fellow at the University of Illinois at Urbana-Champaign before joining
the University of Houston in 2013. He is currently the Bill D. Cook Assistant Professor of
Mechanical Engineering, with joint appointments in Electrical and Computer Engineering,
Materials Science and Engineering, and Biomedical Engineering. Yu’s research interest
encompasses the fields of micro/nano fabrication, solid mechanics, electronic materials,
microelectronics, and sensors. His work focuses on fundamental study and applications of soft
electronics. He holds 3 patents and has 11 pending patents. He is a recipient of Doctoral New
Investigator Award from ACS Petroleum Research Fund (2016), NSF CAREER Award (2016),
Award for Excellence in Research & Scholarship from UH (2016), and Young Investigator
Award from the American Vacuum Society (2015).